Internal stresses in aluminum interconnects

Materials Science Forum

Volumn 347, Issue , 2000, Pages 556-561

  Saerens, A ^a   Van Houtte, P ^a   Witvrouw, A ^b  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; FINITE ELEMENT METHOD; RESIDUAL STRESSES; SILICON; THERMAL STRESS; X RAY DIFFRACTION ANALYSIS;

ALUMINIUM INTERCONNECTS; CRYSTALLITE GROUP METHODS; LOW INCIDENT BEAM ANGLE DIFFRACTION (LIBAD); MACROSCOPIC STRESSES; X RAY STRESS MEASURING APPROACHES;

METALLIC FILMS;

EID: 0033666404     PISSN: 02555476     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)

1. I.C. Noyan, J.B. Cohen, Residual stress - Measurement by diffraction and interpretation, Springer-Verlag, New York (1987).
2. L. De Buyser, Ph.D. thesis, K.U.Leuven (1993).
3. K. Van Acker, L. De Buyser, J.P. Celis, P. Van Houtte, J. Appl. Cryst. 27, 56-66 (1994).
4. H. Dölle, V. Hauk, Z. Metallkunde 70, 682-685 (1979).
5. K. Van Acker, Ph.D. thesis, K.U. Leuven (1996).
6. A. Saerens, P. Van Houtte, B. Meert, C. Quaeyhaegens, submitted to J. Appl. Cryst.
7. P. Van Houtte, L. De Buyser, Acta metall. mater. 41(2), 323-336 (1993).
8. Y.S. Kang, P.S. Ho, J. Electronic Mat. 26(7), 805 (1997).
9. A. Witvrouw, P. Flinn, K. Maex, Mat. Res. Soc. Symp. Proc. 428, 519-524 (1996).
10. J.F. Shackelford, W. Alexander, J.S. Park, CRC Materials Science and Engineering Handbook, CRC Press, 340 (1994).
11. A. Gouldstone, Y.-L. Shen, S. Suresh, C.V. Thompson, J. Mater. Res. 13(7), 1956-1966 (1998).
12. P.R. Besser, A. Sauter, D.B. Fraser, J.C. Bravman, J. Electrochem. Soc. 140 (6), 1769-1772 (1993).
13. R. Venkatraman, J.C. Bravman, J. Mater. Res. 7(8), 2040 (1992).
14. U. Burges, I. Eppler, W. Shilling, H. Schroeder, H. Trinkaus, AIP-Conf. Proc. 373, 3-19 (1996).