A Glass/Silicon Technology for Low-Power Robust Gas Sensors

IEEE Sensors Journal

Volumn 4, Issue 2, 2004, Pages 195-206

  Plaza, J A ^a   Lopez Bosque M J ^a   Gracia I ^a   Cane C ^a   Wöllenstein, Jürgen ^b   Kühner, Gerd ^b   Plescher, Gerd ^b   Böttner, Harald ^b  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

^b FRAUNHOFER INSTITUTE FOR PHYSICAL MEASUREMENT TECHNIQUES IPM   (Germany)

Author keywords

Anodic bonding; Gas sensor; Glass; Microhotplate

Indexed keywords

CHEMICAL BONDS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; GLASS; HIGH TEMPERATURE TESTING; MECHANICAL TESTING; METALLIC COMPOUNDS; MICROMACHINING; OPTIMIZATION; ROBUSTNESS (CONTROL SYSTEMS); SEMICONDUCTOR DEVICES; SILICON;

ANODIC BONDING; ELECTRICAL TESTING; MICROHOTPLATE; THERMAL SIMULATIONS;

CHEMICAL SENSORS;

EID: 2342477300     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2004.823681     Document Type: Article

References (31)

1. D. Lee, "Fabrication and sensing characteristics of micro gas sensor for nitrogen oxides gas detection," in Proc. Transducers, 1999, pp. 1028-1031.
2. 2 thin film derived from percursor," Sens. Actuators B, vol. 62, pp. 55-60, 2000.
3. E. Comini, G. Sberveglieri, M. Ferroni, and G. Mantinelli, "TiO: A novel material for NO2 monitoring," in Proc. Eurosensors XIII, 1999, pp. 851-854.
4. M. Penza, C. Martucci, and G. Cassano, "NOx gas sensing characteristics of WO3 thin films activated by noble metals (Pd, Pt, Au) layers," Sens. Actuators B, vol. 50, pp. 52-59, 1998.
5. W. Göpel and K. D. Schierbaum, "SnO2 sensors: Current status and future prospects," Sens. Actuators B, vol. 27-29, pp. 1-12, 1995.
6. M. Jaeglet, J. Woellenstein, T. Meisinger, G. Mueller, T. Becker, and C. B.-V. Braunmühl, "Micromachined thin film SnO2 gas sensors in temperature pulsed operation mode," in Proc. Eurosensors XIII, 1998, pp. 225-228.
7. Figaro Engineering Inc.: Product Catalogue no. 1 and no. 2, Figaro Engineering Inc., 1995.
8. T. Gessner, K. Gottfried, R. Hoffmann, C. Kaufmann, U. Weiss, E. Charetdinov, P. Hauptmann, R. Lucklum, B. Zimmermann, U. Dietel, G. Springer, and M. Vogel, "Metal oxide gas sensor for high temperature application," Microsyst. Technol., vol. 6, pp. 169-74, Aug. 2000.
9. V. Demarne and A. Grisel, "An integrated low power thin film CO gas sensor on silicon," Sens. Actuators A, vol. 13, pp. 301-313, 1988.
10. A. Götz, I. Grácia, J. A. Plaza, C. Cané, P. Roetsch, H. Böttner, and K. Seibert, "A novel methodology for the manufacturability of robust CMOS semiconductor gas sensor arrays," Sens. Actuators B, vol. 77, pp. 395-400, 2001.
11. P. Roetsch, J. Böttner, K. Seibert, A. Götz, I. Gracia, J. A. Plaza, and C. Cané, "Combination of metal oxide based gas sensors with CMOS electronic circuits on wafer level," in Proc. Eurosensors, 2000, pp. 377-378.
12. J. S. Suehle, R. E. Cavicchi, M. Gaitan, and S. Semantik, "Tin oxide gas sensor fabricated using CMOS micro-hotplates and in-situ processing," IEEE Electron Device Lett., vol. 14, pp. 118-120, Jan. 1993.
13. S. Majoo, J. L. Gland, K. D. Wise, and J. W. Schwank, "A silicon micromachined conductometric gas sensor with a maskless Pt sensing film deposited by selected area CVD," Sens. Actuators B, vol. 35-36, pp. 312-319, 1996.
14. S. Möller, J. Lin, and E. Obermeier, "Material and design considerations for low power microheater modules for gas sensor applications," Sens. Actuators B, vol. 24-25, pp. 343-346, 1995.
15. A. Götz, I. Gracia, C. Cane, and E. Lora-Tamayo, "Thermal and mechanical aspects for designing micromachined low-power gas sensors," in Proc. Micromechanics Europe, 1996, pp. 267-270.
16. D. I. Pomerantz, U.S. Patent 3 397 278, 1968.
17. G. Wallis and D. I. Pomerantz, "Field assisted glass-metal sealing," J. Appl. Phys., vol. 40, no. 10, pp. 3946-3949, Sept. 1969.
18. B. W. van Oudheusden, "Silicon thermal flow sensors," Sens. Actuators B, vol. 30, pp. 5-26, 1992.
19. R. Lenggenhager, H. Baltes, J. Peer, and M. Foster, "Thermoelectric infrared sensors by CMOS technology," IEEE Electron Device Lett., vol. 13, pp. 454-456, Sept. 1992.
20. M. J. Löpez, J. A. Plaza, A. Götz, J. Santander, L. Fonseca, I. Grácia, and C. Cané, "Design and optimization of thermomechanical structures for μ-hotplates," in Proc. MME, 2000.
21. Open and Flexible Fimulation Software Solutions for Every Phase of Product Design. ANSYS Inc. [Online]. Available: http://www.ansys.com
22. K. E. Petersen, "Silicon as a mechanical material," Proc. IEEE, vol. 70, pp. 420-456, May 1982.
23. H. Seidel, L. Csepregi, A. Heuberger, and H. Baumgärtel, "Anisotropic etching of crystalline silicon in alkaline solutions. I. orientation dependence and behavior of pasivation layers," J. Electrochem. Soc., vol. 137, no. 11, pp. 3612-3626, Nov. 1990.
24. _, "Anisotropic etching of crystalline silicon in alkaline solutions, II. Influence of dopants," J. Electrochem. Soc., vol. 137, no. 11, pp. 3626-3632, Nov. 1990.
25. E. Bassous and A. C. Lamberti, "Highly selective KOH-based etchant for boron-doped silicon structures," Microelectron. Eng., vol. 9, pp. 167-170, 1989.
26. I. Grácia, A. Götz, J. A. Plaza, C. Cané, P. Roetsch, H. Böttner, and K. Seibert, "Low-power micromachined structures for gas sensors with improved robustness," in Proc. SPIE Micromachined Devices and Components VI, 2000, pp. 253-263.
27. X. Li, M. Bao, and S. Shen, "Maskless etching of three dimensional silicon structures in KOH," Sens. Actuators B, vol. 57, pp. 47-52, 1996.
28. 2-films," Sens. Actuators B, vol. 70, no. 1-2, pp. 196-202, 2000.
29. J. Bay, P. K. Birch, J. Branebjerg, V. B. Nielsen, and S. Otto, "Normic. Environmental Classification of Microsystems and Introduction to Qualification Testing," Tech. Rep. Delta P1404-1, 1999.
30. I. Simon, N. Bârsan, M. Bauer, and U. Weimar, "Micromachined metal oxide gas sensors: Opportunities to improve sensor performance," Sens. Actuators B, vol. 73, pp. 1-26, 2000.
31. S. A. Microsens. Product Line and Datasheet: Integrated Resistive Gas Sensors, [Online]. Available: http://www.microsens.ch