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1
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3042844902
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"Surface/bulk micromachined high performance silicon microgyroscope"
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Hilton Head Island, SC, Jun
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D. Cho, S. Lee, and S. Park, "Surface/bulk micromachined high performance silicon microgyroscope," in Proc. Hilton Head 2000, Hilton Head Island, SC, Jun. 2000.
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(2000)
Proc. Hilton Head 2000
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Cho, D.1
Lee, S.2
Park, S.3
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2
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0034468093
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"Surface/bulk micromachined Single-crystalline silicon microgyroscope"
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Dec
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S. Lee, S. Park, J. Kim, S. Yi, and D. Cho, "Surface/bulk micromachined Single-crystalline silicon microgyroscope," J. Microelkectromech. Syst., vol. 9, no. 4, pp. 557-567, Dec. 2000.
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(2000)
J. Microelkectromech. Syst.
, vol.9
, Issue.4
, pp. 557-567
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Lee, S.1
Park, S.2
Kim, J.3
Cho, S.4
Yi, D.5
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3
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84944739646
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"Robust SOI process without footing for ultra high-performance microgyroscopes"
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Boston, MA, Jun. 8-12
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J. Kim, S. Park, D. Kwak, H. Ko, W. Carr, J. Buss, and D. Cho, "Robust SOI process without footing for ultra high-performance microgyroscopes," in Proc. Transducers 2003, Boston, MA, Jun. 8-12, 2003, pp. 1691-1694.
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(2003)
Proc. Transducers 2003
, pp. 1691-1694
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Kim, J.1
Park, S.2
Kwak, D.3
Ko, H.4
Carr, W.5
Buss, J.6
Cho, D.7
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4
-
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0842309681
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"A new isolation method for single crystal silicon MEMS and its application to Z-axis microgyroscope"
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Washington, DC, Dec
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S. Park, J. Kim, D. Kwak, H. Ko, D. Cho, W. Carr, and J. Buss, "A new isolation method for single crystal silicon MEMS and its application to Z-axis microgyroscope," in Proc. of IEDM, Washington, DC, Dec. 2003, pp. 969-972.
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(2003)
Proc. of IEDM
, pp. 969-972
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-
Park, S.1
Kim, J.2
Kwak, D.3
Ko, H.4
Cho, D.5
Carr, W.6
Buss, J.7
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5
-
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0031677957
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"A new silicon rate gyroscope"
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Heidelberg, Germany, Jan. 25-29
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W. Geiger, B. Folkmer, J. Merz, H. Sandmaier, and W. Lang, "A new silicon rate gyroscope," in Proc. MEMS'98, Heidelberg, Germany, Jan. 25-29, 1998, pp. 615-620.
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(1998)
Proc. MEMS'98
, pp. 615-620
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Geiger, W.1
Folkmer, B.2
Merz, J.3
Sandmaier, H.4
Lang, W.5
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6
-
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22444443568
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"Angular rate gyroscope with dual anchor support"
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Hilton Head, SC, Jun. 2-6
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G. J. O'Brien, D. J. Monk, and K. Najafi, "Angular rate gyroscope with dual anchor support," in Proc. Hilton Head 2002, Hilton Head, SC, Jun. 2-6, 2002, pp. 285-288.
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(2002)
Proc. Hilton Head 2002
, pp. 285-288
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O'Brien, G.J.1
Monk, D.J.2
Najafi, K.3
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7
-
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84944721130
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"An integrated, vertical-drive, in-plane-sense microgyroscope"
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Boston, MA, Jun. 8-12
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S. A. Bhave, J. I. Seeger, X. Jiang, B. E. Boser, R. T. Howe, and J. Yasaitis, "An integrated, vertical-drive, in-plane-sense microgyroscope," in Proc. Transducers'03, Boston, MA, Jun. 8-12, 2003, pp. 171-174.
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(2003)
Proc. Transducers'03
, pp. 171-174
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Bhave, S.A.1
Seeger, J.I.2
Jiang, X.3
Boser, B.E.4
Howe, R.T.5
Yasaitis, J.6
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8
-
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0034869180
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"A de-coupled vibratory gyroscope using a mixed micro-machining technology"
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Seoul, Korea, May 21-26
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B. Lee, S. Lee, K. Jung, J. Choi, T. Chung, and Y. Cho, "A de-coupled vibratory gyroscope using a mixed micro-machining technology," in Proc. ICRA, Seoul, Korea, May 21-26, 2001, pp. 3412-3416.
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(2001)
Proc. ICRA
, pp. 3412-3416
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Lee, B.1
Lee, S.2
Jung, K.3
Choi, J.4
Chung, T.5
Cho, Y.6
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9
-
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0032666301
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"A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes"
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Orlando, FL, Jan. 17-21
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Y. Mochida, M. Tamura, and K. Ohwada, "A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes," in Proc. MEMS'99, Orlando, FL, Jan. 17-21, 1999, pp. 618-623.
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(1999)
Proc. MEMS'99
, pp. 618-623
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Mochida, Y.1
Tamura, M.2
Ohwada, K.3
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10
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0010952382
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"A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology"
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Munich, Germany, June
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J. Kim, S. Park, and D. Cho, "A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology," in Proc. Transducers 2001, Munich, Germany, June 2001, pp. 756-759.
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(2001)
Proc. Transducers 2001
, pp. 756-759
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Kim, J.1
Park, S.2
Cho, D.3
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11
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85069415305
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"An extended double-SBM process for vertical actuation and sensing using one single-crystalline silicon wafer"
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Singapore, Singapore, Jul
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J. Kim, S. Park, and D. Cho, "An extended double-SBM process for vertical actuation and sensing using one single-crystalline silicon wafer," in Proc. International MEMS Workshop 2001, Singapore, Singapore, Jul. 2001, pp. 291-298.
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(2001)
Proc. International MEMS Workshop 2001
, pp. 291-298
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Kim, J.1
Park, S.2
Cho, D.3
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12
-
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18544391592
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"A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology"
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Apr
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J. Kim, S. Park, and D. Cho, "A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology," Sens. Actuators A, Phys., vol. 97-98, pp. 653-658, Apr. 2002.
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(2002)
Sens. Actuators A, Phys.
, vol.97-98
, pp. 653-658
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Kim, J.1
Park, S.2
Cho, D.3
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13
-
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0010356623
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"A new micromachining technology using (111) silicon"
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Kyungju, Korea, Jun
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S. Lee, S. Park, and D. Cho, "A new micromachining technology using (111) silicon," in Proc. MNC, Kyungju, Korea, Jun. 1998, pp. 174-175.
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(1998)
Proc. MNC
, pp. 174-175
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-
Lee, S.1
Park, S.2
Cho, D.3
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14
-
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0032633034
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"A new micromachining technique with (111) silicon"
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May
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S. Lee, S. Park, and D. Cho, "A new micromachining technique with (111) silicon," Jpn. J. Appl. Phys., vol. 38, pp. 2699-2703, May 1999.
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(1999)
Jpn. J. Appl. Phys.
, vol.38
, pp. 2699-2703
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Lee, S.1
Park, S.2
Cho, D.3
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15
-
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0033352311
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"The surface/bulk micromachining (SBM) process: A new method for fabricating released microelectromechanical systems in single crystal silicon"
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Dec
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S. Lee, S. Park, and D. Cho, "The surface/bulk micromachining (SBM) process: a new method for fabricating released microelectromechanical systems in single crystal silicon," J. Microelectromech. Syst., vol. 8, no. 4, pp. 409-416, Dec. 1999.
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(1999)
J. Microelectromech. Syst.
, vol.8
, Issue.4
, pp. 409-416
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-
Lee, S.1
Park, S.2
Cho, D.3
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16
-
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85069415042
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"Triple Layer Isolation for Silicon Microstructure and Structures Formed Using the Same"
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(Priority: Jul. 3, 2000. Application date: Jun. 19, 2001), May 27
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D. Cho. S. W. Lee, and S. Park, "Triple Layer Isolation for Silicon Microstructure and Structures Formed Using the Same," U.S. Patent no. 6 569 702 (Priority: Jul. 3, 2000. Application date: Jun. 19, 2001), May 27, 2003.
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(2003)
U.S. Patent No. 6 569 702
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Cho, D.1
Lee, S.W.2
Park, S.3
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17
-
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0036544176
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"Honeycomb-shaped deep-trench oxide posts combined with the SBM technology for micromachining single crystal silicon without using SOI"
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April
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S. Lee, S. Park, and D. Cho, "Honeycomb-shaped deep-trench oxide posts combined with the SBM technology for micromachining single crystal silicon without using SOI," Sens. Actuators A, Phys., vol. 97-98, pp. 734-738, April 2002.
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(2002)
Sens. Actuators A, Phys.
, vol.97-98
, pp. 734-738
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-
Lee, S.1
Park, S.2
Cho, D.3
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18
-
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0010401084
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"Honeycomb-shaped deep-trench oxide posts combined with the SBM technology for micromachining single-crystal silicon without using SOI"
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Munich, Germany, June
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S. Lee, S. Park, and D. Cho, "Honeycomb-shaped deep-trench oxide posts combined with the SBM technology for micromachining single-crystal silicon without using SOI," in Proc. Transducers 2001, Munich, Germany, June 2001, pp. 1124-1127.
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(2001)
Proc. Transducers 2001
, pp. 1124-1127
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Lee, S.1
Park, S.2
Cho, D.3
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19
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3042727680
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"A new isolation method for single-crystalline silicon MEMS using localized SOI structure"
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Apr
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S. Park, S. Kim, J. Kim, S. Lee, S. Paik, C. Koo, and D. Cho, "A new isolation method for single-crystalline silicon MEMS using localized SOI structure," in Proc. of the 3rd Korean MEMS Conference, Seoul, Apr. 2001, pp. 129-135.
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(2001)
Proc. of the 3rd Korean MEMS Conference
, pp. 129-135
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-
Park, S.1
Kim, S.2
Kim, J.3
Lee, S.4
Paik, S.5
Koo, C.6
Cho, D.7
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