Under bump metallisation of fine pitch flip-chip using electroless nickel deposition

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 64-71

  Liu, C ^a   Hutt, D A ^a   Whalley, D C ^a   Conway, P P ^a   Mannan, S H ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL ACTIVATION; DEPOSITION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MODIFIED ATMOSPHERE PACKAGING; NICKEL; SOLDERING;

ACTIVATION MECHANISMS; ELECTRICAL RESISTANCE MEASUREMENT; ELECTROLESS NICKEL; ELECTROLESS NICKEL DEPOSITION; FINE-PITCH FLIP CHIP; FLIP CHIP ASSEMBLIES; SOLDER PASTE PRINTING; UNDER BUMP METALLISATION;

CHIP SCALE PACKAGES;

EID: 21644478739     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904134     Document Type: Conference Paper

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