Zincation characterization for electroless Ni/Au UBM of solder bumping technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 34-40

  Tan, Q ^a   Beddingfield, C ^a   Mistry, A ^a   Mathew, V ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COATINGS; BINARY ALLOYS; INDUSTRIAL ELECTRONICS; LEAD ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

ALUMINUM PAD; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTROLESS NI; RESISTANCE MEASUREMENT; SOLDER BUMPING; SOLDER PASTE; THERMAL CONDITIONING; VISUAL INSPECTION;

FLIP CHIP DEVICES;

EID: 85013865644     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731012     Document Type: Conference Paper

References (4)

1. Miller L. F. "Controlled Collapse Reflow Chip Joining" IBM J. of RES. DEVELOP, pp. 239-250. May 1969.
2. Patterson, D. S., Elenius, P., Leal, J. A., "Wafer Bumping Technologies-A Comparative Analysis of Solder Deposition Processes and Assembly Consideration", Proceedings of InterPack. EEP-Vol. 19-1, Advances in Electronic Packaging, pp. 337-351.
3. Audet, J. et al., "Low Cost Bumping Process for Flip Chip", Proc. Flip Chip, BGA, TAB& AP Symp., pp. 16-21, Feb, 1995.
4. Fang, T. Motorola Electroless bumping process manual.