Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5343, Issue , 2004, Pages 176-185

  Wolter, Alexander ^a   Schenk, Harald ^a   Korth, Hilmar ^a   Lakner, Hubert ^a  

^a FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

Author keywords

Beam deflection; Bulk micromachining; Comb drive; Fracture stress; MEMS; Micro mirror; Micro scanning mirror; MOEMS; Silicon hinges; Torsional stress

Indexed keywords

FATIGUE OF MATERIALS; FRACTURE TOUGHNESS; HINGES; MICROMACHINING; MIRRORS; SCANNING; SEMICONDUCTING SILICON; TORSIONAL STRESS;

BEAM DEFLECTION; BULK MICROMACHINING; MICROMIRRORS; MICROSCANNING MIRRORS;

MICROELECTROMECHANICAL DEVICES;

EID: 2142806976     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524872     Document Type: Conference Paper

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