Quantitative transmission electron microscopy analysis of the pressure of helium-filled cracks in implanted silicon

Microscopy and Microanalysis

Volumn 10, Issue 2, 2004, Pages 199-214

  Tillmann, K ^a   Huging N ^a   Trinkaus, H ^a   Luysberg, M ^a  

^a FORSCHUNGSZENTRUM JÜLICH   (Germany)

Author keywords

Crack shaped cavities; Diffraction contrast imaging; Helium implantation; Image similations; Silicon; Transmission electron microscopy

Indexed keywords

HELIUM; SILICON;

CHEMISTRY; CONFERENCE PAPER; ELASTICITY; ELECTRON MICROSCOPY; MECHANICAL STRESS; METHODOLOGY;

ELASTICITY; HELIUM; MICROSCOPY, ELECTRON; SILICON; STRESS, MECHANICAL;

EID: 2142726042     PISSN: 14319276     EISSN: None     Source Type: Journal    
DOI: 10.1017/S1431927604040024     Document Type: Conference Paper

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