Development of real-time microvision system based on three-dimensional LSI technology

Journal of Intelligent Material Systems and Structures

Volumn 7, Issue 3, 1996, Pages 342-345

  Yu, Kee Ho ^a   Kudoh, Yoshihara ^a   Matsumoto, Takuji ^a   Pidin, Sergey ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; DATA TRANSFER; DIGITAL ARITHMETIC; IMAGE PROCESSING; LAPLACE TRANSFORMS; LOGIC CIRCUITS; LSI CIRCUITS; MICROELECTRONICS; REAL TIME SYSTEMS; SIGNAL PROCESSING; SPURIOUS SIGNAL NOISE; THREE DIMENSIONAL COMPUTER GRAPHICS;

ALIGNMENT TOLERANCE; IMAGE DATA ARRAYS; IMAGE INFORMATION SIGNALS; LAPLACIAN OPERATOR; REAL TIME MICROVISION SYSTEM; SYSTEM CONFIGURATION; THREE DIMENSIONAL LSI TECHNOLOGY;

COMPUTER VISION;

EID: 0030146293     PISSN: 1045389X     EISSN: None     Source Type: Journal    
DOI: 10.1177/1045389X9600700316     Document Type: Article

References (6)

1. Akasaka, Y. 1986. "Three-Dimensioaal IC Trends", Proc. IEEE, 74:1703-1714.
2. Kioi, K. et al. 1992. "Design and Implementation of a 3D-SLI Image Sensing Processor", IEEE J. of Solid-State Circuits, 27(8):1130-1139.
3. Maruyama, M. et al. 1990. "An Image Signal Multiprocessor on a Single Chip," IEEE J. of Solid-State Circuits, 25(6):1476-1483.
4. Matsumoto, T., et al. 1995. "Three-Dimensional Integration Technology Based on Wafer Bonding Technique Using Microbumps," Extended Abstracts of the 1995 Int. Conf. on Solid State Devices and Materials, pp. 1073-1074.
5. Special Issue. 1995. "Real-Time Vision", J. of the Robotic Society of Japan, 13(3):305-354.
6. Yamada, Y. and M. Ishikawa. 1993. "High Speed Target Tracking Using Massively Parallel Processing Vision", Proc. IEEE/RSJ Int. Conf. on Intelligent Robots and Systems, pp. 267-272.