Flip chip bonding technique using transferred microsolder bumps

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 4, 1997, Pages 327-334

  Tsunetsugu, H ^a   Hayashi, T ^a   Hosoya, M ^a   Katsura, K ^a   Hirano, M ^a   Imai, Y ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

MANUFACTURE; OPERATIONS RESEARCH; PERFORMANCE; RELIABILITY; SOLDERING; SOLDERING ALLOYS; SUBSTRATES;

FLIP CHIP BONDING;

OPTICAL COMMUNICATION EQUIPMENT;

EID: 0031246511     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.650965     Document Type: Article

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