Compact triangulation sensor array constructed by wafer bending

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 4 B, 2005, Pages 2874-2878

  Endou, Satoshi ^a   Ishimori, Masahiro ^a   Sasaki, Minoru ^a   Hane, Kazuhiro ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Optical metrology; Prealignment; Three dimensional structure; Triangulation distance sensor; Wafer bending

Indexed keywords

ARRAYS; BENDING (DEFORMATION); LENSES; OPTICAL WAVEGUIDES; PHOTOLITHOGRAPHY; SILICON WAFERS; SUBSTRATES; TRIANGULATION; X RAY LITHOGRAPHY;

OPTICAL METROLOGY; PREALIGNMENT; THREE-DIMENSIONAL STRUCTURE; TRAINGULATION DISTANCE SENSORS; WAFER BENDING;

SENSORS;

EID: 21244437515     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.2874     Document Type: Conference Paper

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