System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 2, 2005, Pages 310-319

  Jones, Robert E ^a   Ramiah, Chandra ^a,b   Kamgaing, Telesphor ^a,b,c   Banerjee, Suman K ^a,b   Tsai, Chi Taou ^a,b   Hughes, Henry G ^b   De Silva, Ananda P ^a,b   Drye, James ^a,b   Li, Li ^a,b   Blood, William ^b   Li, Qiang ^a,b   Vaughan, Clifford R ^a,b   Miglore, Roger ^a,b   Penunuri, David ^b,d   Lucero, Rudy ^b,e   Frear, Darrel R ^a,b   Miller, Mel F ^a,b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b MOTOROLA INC   (United States)

^c INTEL CORPORATION   (United States)

^d ROCKWELL COLLINS   (United States)

^e GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS   (United States)

Author keywords

Land mobile radio cellular systems; Multichip modules; Semiconductor device packaging; Surface acoustic wave (SAW) filters

Indexed keywords

ACOUSTIC SURFACE WAVE FILTERS; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRIC INDUCTORS; MOBILE RADIO SYSTEMS; MULTICHIP MODULES; TRANSCEIVERS; WSI CIRCUITS;

LAND MOBILE RADIO CELLULAR SYSTEMS; QUAD PACK NO-LEAD (QFN) PACKAGE;

CHIP SCALE PACKAGES;

EID: 20344372657     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.846935     Document Type: Article

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