System in a package solution for RF receiver with SAW filter integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1012-1017

  Lee, Jong Soo ^a   Lee, Young Min ^a   Nam, Choong Mo ^a   Jeong, In Ho ^a   Kim, Dong Wook ^a   Kwon, Young Se ^b  

^a Telephus Inc   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE FILTERS; AMPLIFIERS (ELECTRONIC); BANDWIDTH; CAPACITORS; CODE DIVISION MULTIPLE ACCESS; ELECTRIC INDUCTORS; ELECTRIC LINES; RADIO RECEIVERS; SILICON WAFERS; SUBSTRATES;

RADIO FREQUENCY (RF) RECEIVERS;

CHIP SCALE PACKAGES;

EID: 0036297030     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008225     Document Type: Article

References (6)

1. High Q LTCC-based passive library for wireless system-on-package (SOP) module development
2. Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
3. Monolithic planar inductor and waveguide substrate on silicon with performance comparable to those in GaAs MMIC
4. Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrate
5. High performance planar inductor on oxidized porous silicon (OPS) substrate
6. Ultra high Q inductor and RF integrated passive devices on thick oxide Si substrate