Multidisciplinary reliability design of electronics packaging based on the first order reliability method and structural equation modeling

Collection of Technical Papers - 10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference

Volumn 6, Issue , 2004, Pages 3571-3589

  Hirohata, Kenji ^a   Hisano, Katsumi ^a   Mukai, Minoru ^a   Takahashi, Hiroyuki ^a   Kawamura, Noriyasu ^a   Iwasaki, Hideo ^a   Kawakami, Takashi ^a   Yu, Qiang ^b   Shiratori, Masaki ^b  

^a TOSHIBA CORPORATION   (Japan)

^b YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE PROBABILITY; FIRST ORDER RELIABILITY METHOD; MULTIDISCIPLINARY RELIABILITY DESIGN; STRUCTURAL EQUATION MODELING;

COMPUTER SIMULATION; DIELECTRIC LOSSES; MATHEMATICAL MODELS; PRODUCT DESIGN; STATISTICAL METHODS; STRUCTURAL OPTIMIZATION; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 20344364158     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (46)

1. Hasofar, M.A. and Lind,N.C., J.Eng.Mech.Div., Proc.ASCE, 100-EM1,1974, 111.
2. Christensen, P.T., Baker,M.J., Structural Reliability Theory and Its Applications, Springer Verlag, 1982.
3. Hohenbichler, M., Rackwitz, R., First-Order Concepts in System Reliability, Structural Safety 4, 1983, pp. 177-188.
4. Ang,A.H.-S., Tang,W.H., Probability Concepts in Engineering Planning and Design, Vol.II. Decision, Risk, and Reliability, McGraw Hill, 1984.
5. Marek,.P, Gustar,.M., Anagnos, T., Simuation-based Reliability Assessment for Structural Engineers, CRC Press, 1996.
6. Guedes Soares,C.(ed.), Probabilistic Methods for Structural Design, Kluwer Academic Publishers, 1997.
7. Blischke, W.R.,Prabhakar Murthy,D.N., Reliability Modeling, Prediction, and Optimization, Wiley series in probability and statistics, John Wiley & Sons, 2000.
8. Lisnianski,A., Levitin,G., Multi-state System Reliability, Assessment, Optimization and Applications, World Scientific, 2003.
9. Rosenblatt, M., "Remarks on a Multivariate Transformation," Annals of Math. Stat., Vol. 23, No. 3, 1952, pp.470-472.
10. Ditlevsen, O., "Narrow Reliability Bounds for Structural Systems," J. Struct. Mech., Vol.7, 1979, pp453-472.
11. Evans, J.W., Evans, J.Y. and Yu, B.K., "Designing and Building-In Reliability in Advanced Microelectronic Assemblies and Structures," IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A, Vol.20,No.1, 1997, pp. 38-45.
12. Dasgupta, A., Pecht, M.G. and Mathieu, B., "Design-of-experiment methods for computational parametric studies in electronic packaging," Finite Elements in Analysis and Design, 30, 1998, pp. 125-146.
13. Tu, J., Choi, K. K., and Park, Y. H., "A New Study on Reliability Based Design Optimization," Trans. ASME J.Mech. Design., Vol.121, 1999, pp.557-564.
14. Cruse, T.A., Burnside, O.H., Qu, Y.T., Polch, E.Z. and Dias, J.B., "Probabilistic Structural Analysis Methods for Select Space Propulsion System Structural Components (PSAM)," Computers & Structures Vol.29, No. 5, 1998, pp.891-901.
15. Myers,R.H., Montgomery,D.C., Response Surface Methodology :Process and Product Optimization Using Designed Experiments, John Wiley & sons, 1995.
16. Kashiwamura, T., Shiratori, M.,and Yu.,Q., "Statistical optimization method," Computer Aided Optimum Design of Structures V, 1997, pp.213-227.
17. Itoh, T., "Overview for quasi-planar transmission lines," IEEE Trans. Microwave Theory Tech., Vol. 37, 1989, pp.275-280.
18. Bahl, I.J., Bhartia, P., Microwave Solid State Circuit Design, 1988, John Wiley & Sons.
19. Yamashita, E., Atsuki, K., Ueda, T., "An approximate dispersion formula of microstrip lines for computer-aided design of microwave integrated circuits," IEEE Trans. Microwave Theory Tech., Vol. 27, 1979, pp,1036-1038.
20. Itho, T. (ed.), Planar Transmission Line Structures, 1987, IEEE Press.
21. Katehi, P.B., Alexonpoulos, A., "Frequency-dependent characteristics of microstrip discontinuities in millimeter-wave integrated circuits," IEEE Trans. Microwave Theory Tech., Vol. 33, 1985, pp. 1029-1035.
22. Harrington, R. F., "Field Computation by Moment Methods," Macmillan, 1968, New York.
23. Itho, T., Pelos, G., Silvester, P.P., Finite Element Software for Microwave Engineering, John Wiley & Sons, 1996.
24. Kisling, K., "3D EM simulator sets new performance standard," Applied Microwaves & Wireless, 1997, pp. 90-94.
25. Taflove, A., Computational Electromagnetics, The Finete-Difference Time-Domain Method, Artech House, 1995.
26. Hoefer, W.J.R., "The Transmission-Line Matrix Method-Theory and Applications," IEEE Trans. Microwave Theory Tech., Vol. 33, 1985, pp. 882-893.
27. Iwasaki, H., Ishizuka, M., "Forced Convection Air Cooling Characteristics of Plate Fins for Notebook Personal Computers," ITherm 2000 Proceedings Vol.II, 2000, pp.21-26.
28. S.V. Patankar, Numerical Heat Transfer and Fluid Flow, McGraw-Hill, New York, 1980.
29. Y.Sata, H.Iwasaki and M.Ishizuka, "Development of Prediction Technique for Cooling Performance of Finned Heat Sink in Uniform Flow," IEEE Transactions on CPMT, Part A, Vol.18, No.3, 1997, pp.160-166.
30. Mukai, M., Kawakami, Takahashi, K., Kishimoto, K., and Shibuya, T., "Thermal Fatigue Life of Solder Bumps in BGA," JSME Int. J., Vol.41, No.2, A, 1998, pp.260-266.
31. Ishikawa, T., Kobayashi, M., Ohno, N., Takahashi, H., Mukai, M. and Kawakami, T., Proc. of Annual Meeting of JSME, No. 013-1, 2001, pp.89-90.
32. Kobayashi, M., Mukai, M., Takahashi, H., Ohno, N., Kawakami, T. and Ishikawa, T., "Implicit integration and consistent tangent modulus of a time-dependent non-unified constitutive model," Int. J. Number. Meth. Engng., Vol.58, 2003, pp.1523-1543.
33. Takahashi, H., Kawakami, T., Mukai, M., Mori, I., Tateyama, K., Ohno, N., "Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints," 2003 ICEP Proc., 2003, pp.215-220.
34. Mukai, M., Kawakami, T., Hiruta, Y., Takahashi, K., Kishimoto, K., and Shibuya, T., "Fatigue Life Estimation of Solder Joints in SMT-PGA Packages", Trans. ASME, J. Electronic Packaging, 120-2, 1998, pp.207-212.
35. Mukai, M., Kawakami, Takahashi, K., Kishimoto, K., and Shibuya, T., "Thermal Fatigue Life of Solder Bumps in BGA", JSME Int. J., Vol.41, No.2, A, 1998, pp.260-266.
36. Mukai, M., Kawakami, T., Endo, T., Hiruta, Y., and Takahashi, K., "Elastic-Creep Thermal Stress Analyses for the SMT-PGA Package's Solder Joint", Proceedings of the ASMEWAM, AMD-Vol. 187, 1994, pp. 197-203.
37. Doi, K., Hirano, N., Okada, T., Hiruta, Y., Sudo, T., M.Mukai, 1995, "Prediction of thermal fatigue life for encapsulated flip chip interconnection," Proc. ISHM '95, 1995, pp.247-252.
38. Hirohata, K., Mukai, M., Kawamura, N., Kawakami, T., Yu, Q., Shiratori, M., "Stochastic structural reliability design for electronics packages using response surface methodology and Bayes' theory," InterPACK'01, Proc., IPACK2001-15590, 2001.
39. Watanabe,S., Hiroyasu, T., Miki, M., "Neighborhood Cultivation Genetic Algorithm for Multi-Objective Optimization Problems," Proc. 4th Asia-Pacific Conference on Simulated Evolution And Learning (SEAL-2002), 2002, pp.198-202.
40. Joreskog, K. G., Lawley, D. N., "New Methods in maximum likelihood factor analysis," British J. Math. Statist. Psycol., Vol. 21, 1968, pp.85-96.
41. Joreskog, K. G., A general method for analysis of covariance structures, Biometrika, Vol.57, 1970, pp.239-251.
42. Joreskog, K. G., Structural analysis of covariance and correlation matrices, Psychometrika, Vol.43, 1978, pp.443-477.
43. Hoyle, R. H., Structural Equation Modeling: Concepts, Issues, and Applications, Sage Pubns, 1995.
44. Marcoulides, G. A., Schumacker, R. E., Advanced Structural Equation Modeling: Issues and Techniques, Lawrence Erlbaum Assoc, 1996.
45. Maruyama, G. M., Basics of Structural Equation Modeling, Sage Pubns, 1997.
46. Byrne, B. M., Structural Equation Modeling With Amos: Basic Concepts, Applications, and Programming (Multivariate Applications Book Series), Lawrence Erlbaum Associates, 2000.