Designing and building-in reliability in advanced microelectronic assemblies and structures

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 1, 1997, Pages 38-45

  Evans, John W ^a   Evans, Julian Y ^b   Yu, Byung Kil ^a,c  

^a Ajou University   (South Korea)

^b NASA GODDARD SPACE FLIGHT CENTER   (United States)

^c Institute for Advanced Engineering (IAE)   (South Korea)

Author keywords

Electronic components; Fatigue; Modeling; Monte Carlo; Multichip module; Reliability; Simulation; Via

Indexed keywords

COMPONENTS; COMPUTER SIMULATION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MONTE CARLO METHODS; MULTICHIP MODULES; PRODUCT DESIGN; RELIABILITY; SYSTEMS ENGINEERING;

ELECTRONIC COMPONENT; MANUFACTURING VARIABILITY; MICROELECTRONIC ASSEMBLY; MICROELECTRONIC STRUCTURES; PROCESS DEVELOPMENT; VIRTUAL EXPERIMENT;

ELECTRONICS PACKAGING;

EID: 0031095263     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.558542     Document Type: Article

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