Fatigue life estimation of solder joints in SMT-PGA packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 2, 1998, Pages 207-212

  Mukai, M ^a   Kawakarni, T ^a   Hiruta, Y ^a   Takahashi, K ^a   Kishimoto, K ^b   Shibuya, T ^b  

^a TOSHIBA CORPORATION   (Japan)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELASTICITY; FATIGUE OF MATERIALS; SOLDERING; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

PIN GRID ARRAY (PGA) PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032096634     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792623     Document Type: Article

References (6)

1. Kitano, M., Kumazawa, T., and Kawai, S., 1992, “A New Evaluation Method for Thermal Fatigue of Solder Joint," Advances in Electronic Packaging, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic PackagingEEP-Vol. 1-1, pp. 301-308.
2. Lau, J. H., Rice, D.W., and Avery, P.A., 1987, “Elastoplastic Analysis of Surface-Mount Solder Joints,”IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. CHMT-10, No. 3, pp. 346-357.
3. Mukai, M., Kawakami, T., Endo, T., and Takahashi, K., 1991, “Elastic-Creep Behavior and Fatigue Life in an IC Package Solder Joint,” Proceedings of JSME 4th Computational Mechanics Conference, No, 910-79, pp. 223-224.
4. Mukai, M., Kawakami, T., Endo, T., and Takahashi, K., 1992, “The Demonstration on Elastic-Creep Thermal Stress Analyses for IC’s 63Sn-37Pb Solder Joints,”Proceedings ofJSME The 70th JSME Fall Annual Meeting, No. 920-78, pp. 360-362.
5. Yebisuya, T., and Kawakubo, T., 1993, “Creep and Tensile Properties of Cast Bi-Sn, Bi-Pb, and Bi-Sn-Pb Solders,”J. Japan Inst Metals, Vol. 57 No 4 do.
6. Hiruta, Y., Hirano, N., Yamaji, Y., Mukai, M., Motoyama, Y., Homma R., Ohno, J., and Sudo, T., 1993, “An 820 Pin PGA for Ultralarge-Scale BiCMOS Devices,”IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 16, No. 8, pp. 893-901.