Design-of-experiment methods for computational parametric studies in electronic packaging

Finite Elements in Analysis and Design

Volumn 30, Issue 1-2, 1998, Pages 125-146

  Dasgupta, Abhijit ^a   Pecht, Michael G ^a   Mathieu, Barry ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; PARAMETER ESTIMATION; PRODUCT DESIGN; RELIABILITY; SURFACE PROPERTIES;

SURFACE ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0032114696     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(98)00033-X     Document Type: Article

References (7)

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2. B. Mathieu, M.S. thesis (1993).
3. C. Daniel, Use of half-normal plots in interpreting factorial two level experiments, Technometrics 1 (1959) 311-342.
4. MARC (1988) Marc Analysis Research Corporation, Revision K.3.
5. B. Mathieu (1993), Stress analysis of glass lead seals under general mechanical loading, M.S. Thesis, University of Maryland, College Park, MD. MIL-STD-883C Test Method 2004.
6. A. Dasgupta, V. Ramappan, Simulation of the influence of manufacturing quality on reliability of vias, ASME J. Electron. Packaging 117 (2) (1995) 141-146.
7. V. Gupta, D. Barker, Modeling solder joint fatigue life for gullwing leaded packages part 1 - elastic plastic stress model, ASME J. Electron. Packaging 117 (2) (1995) 123-129.