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Volumn 20, Issue 2, 1997, Pages 160-166

Development of prediction technique for cooling performance of finned heat sink in uniform flow

Author keywords

Electronic equipment; Forced convection; Heat transfer; Heat transfer prediction; Numerical analysis; Plate fin heatsink

Indexed keywords

COMPUTER SIMULATION; COOLING; HEAT CONVECTION; NUMERICAL ANALYSIS; REYNOLDS NUMBER;

EID: 0031162347     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.588568     Document Type: Article
Times cited : (17)

References (10)
  • 1
    • 0028496476 scopus 로고
    • Effect of flow bypass on the performance of longitudinal fin heat sinks
    • R. A. Wirtz, W. Chen, and R. Zhou, "Effect of flow bypass on the performance of longitudinal fin heat sinks," Trans. ASME J. Electron. Packag., vol. 116, pp. 206-211, 1994.
    • (1994) Trans. ASME J. Electron. Packag. , vol.116 , pp. 206-211
    • Wirtz, R.A.1    Chen, W.2    Zhou, R.3
  • 3
    • 0018036179 scopus 로고
    • Forced convection heat transfer from a shrouded fin array with and without tip clearance
    • E. M. Sparrow, B. R. Baliga, and S. V. Patankar, "Forced convection heat transfer from a shrouded fin array with and without tip clearance," Trans. ASME J. Heat Transfer, vol. 100, pp. 572-579, 1978.
    • (1978) Trans. ASME J. Heat Transfer , vol.100 , pp. 572-579
    • Sparrow, E.M.1    Baliga, B.R.2    Patankar, S.V.3
  • 4
    • 85004498354 scopus 로고
    • Effect of tip-to-shroud clearance on turbulent heat transfer from a shrouded, longitudinal fins array
    • E. M. Sparrow and D. C. Kadle, "Effect of tip-to-shroud clearance on turbulent heat transfer from a shrouded, longitudinal fins array," Trans. ASME J. Heat Transfer, vol. 108, pp. 519-524, 1986.
    • (1986) Trans. ASME J. Heat Transfer , vol.108 , pp. 519-524
    • Sparrow, E.M.1    Kadle, D.C.2
  • 5
    • 33748636673 scopus 로고
    • Algorithm for prediction of the thermal resistance of finned LSI packages mounted on a circuit board
    • in Japanese
    • H. Matsushima, T. Yanagida, and Y. Kondo, "Algorithm for prediction of the thermal resistance of finned LSI packages mounted on a circuit board," Trans. Jpn. Soc. Mech. Eng., Ser. B, vol. 58, no. 546, pp. 548-553, 1992, in Japanese.
    • (1992) Trans. Jpn. Soc. Mech. Eng., Ser. B , vol.58 , Issue.546 , pp. 548-553
    • Matsushima, H.1    Yanagida, T.2    Kondo, Y.3
  • 6
    • 0027989145 scopus 로고
    • Cooling performance of plate fins for multichip modules
    • Washington, DC
    • H. Iwasaki, T. Sasaki, and M. Ishizuka, "Cooling performance of plate fins for multichip modules," in Proc. I-THERM IV, Washington, DC, 1994, pp. 144-147.
    • (1994) Proc. I-THERM IV , pp. 144-147
    • Iwasaki, H.1    Sasaki, T.2    Ishizuka, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.