Ablation and cleaning of wafer surface by excimer laser

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4274, Issue , 2001, Pages 9-17

  Kim, Yong Kee ^a   Kim, Dae Jin ^a   Ryu, Je Kil ^a   Pak, Sung Sik ^a  

^a Hantech Co Ltd Korea   (South Korea)

Author keywords

AFM; Laser cleaning; Particle removal; Photoresist stripping; Reynolds number; Thermal expansion; UV excimer laser; Van der Waals force; Wafer cleaning

Indexed keywords

ABLATION; ALUMINA; ALUMINUM OXIDE; ATOMIC FORCE MICROSCOPY; DEIONIZED WATER; DRY CLEANING; EXCIMER LASERS; FLAT PANEL DISPLAYS; IRRADIATION; LASER APPLICATIONS; MICROELECTRONICS; PHOTORESISTS; RADIATION; REYNOLDS NUMBER; RHENIUM ALLOYS; SILICA; STRIPPING (REMOVAL); SURFACE ROUGHNESS; THERMAL EXPANSION; VAN DER WAALS FORCES; VIRTUAL STORAGE;

LASER CLEANING; PARTICLE REMOVAL; PHOTORESIST STRIPPING; UV-EXCIMER LASERS; WAFER CLEANING;

SURFACE CLEANING;

EID: 1942530470     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.432546     Document Type: Conference Paper

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