Influence of post-CMP cleaning on Cu interconnects and TDDB reliability

IEEE Transactions on Electron Devices

Volumn 52, Issue 5, 2005, Pages 934-941

  Noguchi, Junji ^a   Konishi, Nobuhiro ^a   Yamada, Youhei ^a  

^a HITACHI LTD   (Japan)

Author keywords

Corrosion; Cu; Friction; Integrated circuit interconnections; Reliability; Surface cleaning

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; CORROSION; ELECTRIC BREAKDOWN; ETCHING; FRICTION; HYDROFLUORIC ACID; OPTICAL INTERCONNECTS; ORGANIC ACIDS; POLYVINYL ALCOHOLS; RELIABILITY; SURFACE CLEANING;

DILUTED HYDROFLUORIC ACID (DHF); INTEGRATED CIRCUIT INTERCONNECTIONS; TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB);

INTEGRATED CIRCUIT MANUFACTURE;

EID: 18844447776     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2005.846316     Document Type: Article

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