Surface-modified polymeric pads for enhanced performance during chemical mechanical planarization

Thin Solid Films

Volumn 483, Issue 1-2, 2005, Pages 261-269

  Deshpande, S ^a,b   Dakshinamurthy, S ^b   Kuiry, S C ^a,b   Vaidyanathan, R ^b   Obeng, Y S ^c   Seal, S ^a,b  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

^b University of Central Florida   (United States)

^c psiloQuest Inc   (United States)

Author keywords

ASP; CMP; FTIR; Nanoindentation; PECVD; Polyurethane; TEOS; XPS

Indexed keywords

CHEMICAL MECHANICAL POLISHING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HARDNESS; HYDROGEN PEROXIDE; HYDROPHILICITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SLURRIES; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

APPLICATION SPECIFIC PADS (ASP); NANOINDENTATION; POLISHING SLURRIES; POLYMERIC PADS;

POLYMERS;

EID: 18844428301     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.12.063     Document Type: Article

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