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Volumn 97, Issue 9, 2005, Pages

Strain compensation in boron-indium coimplanted laser thermal processed silicon

Author keywords

[No Author keywords available]

Indexed keywords

CODOPED LAYERS; DEACTIVATION KINETICS; DOPANTS; LASER THERMAL PROCESSED (LTP);

EID: 18844404955     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1891282     Document Type: Article
Times cited : (7)

References (14)
  • 6
    • 78649898645 scopus 로고    scopus 로고
    • Laser Thermal Processing (LTP) for Fabrication of Ultra-shallow, Hyper-Abrupt, Highly Activated Junctions for Deca-nanameter MOS Transistors
    • Toronto, Canada
    • S. Talwar, Y. Wang, and C. Gelatos, Laser Thermal Processing (LTP) for Fabrication of Ultra-shallow, Hyper-Abrupt, Highly Activated Junctions for Deca-nanameter MOS Transistors., presented at Electrochemical Society Symposium Proceeding, Toronto, Canada, 2000 (unpublished).
    • (2000) Electrochemical Society Symposium Proceeding
    • Talwar, S.1    Wang, Y.2    Gelatos, C.3
  • 9
    • 0036453143 scopus 로고    scopus 로고
    • Electrical and Structural Characterization of Boron Implanted Silicon Following Laser Thermal Processing
    • K. A. Gable, K. S. Jones, M. E. Law, L. S. Robertson, and S. Talwar, Electrical and Structural Characterization of Boron Implanted Silicon Following Laser Thermal Processing., presented at MRS Fall Meeting, Symposium C, 2002 (unpublished).
    • (2002) MRS Fall Meeting, Symposium C
    • Gable, K.A.1    Jones, K.S.2    Law, M.E.3    Robertson, L.S.4    Talwar, S.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.