High-reliability, high-performance RF micromachined switch using liquid metal

Journal of Microelectromechanical Systems

Volumn 14, Issue 2, 2005, Pages 214-220

  Kondoh, You ^a,b   Takenaka, Tsutomu ^a,c   Hidaka, Tetsuya ^a,b   Tejima, Go ^a,d   Kaneko, Yasuhisa ^a,e   Saitoh, Mitsuchika ^a  

^a YOKOGAWA ANALYTICAL SYSTEMS INC   (Japan)

^b OLYMPUS CORPORATION   (Japan)

^c PANASONIC CORPORATION   (Japan)

^d TOYOTA MOTOR CORPORATION   (Japan)

^e FUJIFILM CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FATIGUE OF MATERIALS; GLASS; HEATING; INSERTION LOSSES; LIQUID METALS; MERCURY (METAL); REED RELAYS; SWITCHES; WEAR OF MATERIALS;

CONTACT SURFACES; GAS EXPANSION; MICROMACHINED SWITCH; THIN FILM HEATERS;

MICROELECTROMECHANICAL DEVICES;

EID: 18844391749     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.839604     Document Type: Article

References (8)

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