Advanced thermal interface materials for enhanced flip chip BGA

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 564-570

  Kohli, Punit ^a   Sobczak, Martin ^a   Bowin, Jeff ^a   Matthews, Michael ^a  

^a Ablestik Laboratories   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; COPPER; FLIP CHIP DEVICES; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); SILICON; SILVER; TEMPERATURE CONTROL; THERMAL CYCLING; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; FLIP CHIP BALL GRID ARRAY; HEAT SPREADER; THERMAL INTERFACE MATERIALS;

ELECTRONICS PACKAGING;

EID: 0034829095     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927784     Document Type: Article

References (25)

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