Characterization of a thermal interface material for burn-in application

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 36-41

  Dean, Nancy F ^a   Gupta, Anurag ^a  

^a Honeywell Electronic Materials   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; FAILURE (MECHANICAL); FAILURE ANALYSIS; HEAT RESISTANCE; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); MATERIALS TESTING; SHEAR STRENGTH; TENSILE STRENGTH; THERMAL CYCLING;

BURN-IN CYCLES; THERMAL INTERFACE MATERIALS;

SEMICONDUCTOR DEVICES;

EID: 0033678231     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)