Improvement of Adhesion for Layer to Layer Connection for Build-up Printed Circuit Boards

Journal of The Japan Institute of Electronics Packaging

Volumn 1, Issue 6, 1998, Pages 483-488

  Ishibashi, Junichi ^a   Ichikawa, Takumi ^a   Kobayashi, Takeshi ^a   Honma, Hideo ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Additive Process; Adhesion Strength; Build up Technology; Electroless Cu Plating; Etching

Indexed keywords

EID: 85009544212     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.1.483     Document Type: Article

References (2)

1. Y. Tsukada, S. Tsuchida, Y. Mashimoto: “Surface Laminar Circuit and Flip Chip Attach Packaging”, Proc. 7th IMC, June 3~5, p. 252, (1991).
2. Y. Uno, Y. Takahashi, S. Ozawa, K. Nakakuki, Y. Iguchi, T. Kanamori, Y. Kasuya: “High Density Interconnection Technology for Thin Film Multilayer Substrate”, IMC 1994 Proc., WB1-4, p. 61, April (1994).