Basic Study for Direct Metallization Using Surface Modification of Polyimide and Epoxy Resin

Journal of The Japan Institute of Electronics Packaging

Volumn 2, Issue 5, 1999, Pages 390-393

  Nawafune, Hidemi ^a   Seita, Masaru ^b   Nishioka, Taro ^a   Kusaka, Masaru ^b   Tsuji, Haruo ^a   Mizumoto, Shozo ^a  

^a KONAN UNIVERSITY   (Japan)

^b LeaRonal Japan Incorporation   (Japan)

Author keywords

Conductive Copper Thin Film; Direct Metallization; Epoxy Resin; Polyimide Resin; Surface Modification

Indexed keywords

EID: 85009630360     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.2.390     Document Type: Article

References (1)

1. R. Silversein, G. Bassler, T. Morrill 1992.