Influence of Substrate Surface Shape on Peel-off Strength between Aluminum Nitride Substrates and an Epoxy Modified Polyimide Adhesive

Journal of Japan Institute of Electronics Packaging

Volumn 3, Issue 6, 2000, Pages 494-500

  Asai, Hironori ^a   Iwase, Nobuo ^a   Suga, Tadatomo ^b  

^a TOSHIBA CORPORATION   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

Aluminum Nitride; Package; Peel off Strength; Polyaminobismaleimide; Surface Roughness

Indexed keywords

EID: 0000099765     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.3.494     Document Type: Article

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