Pre-applied underfill adhesives for flip chip attachment

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 178-183

  Charles, Scott ^a   Kropp, Michael ^a   Kinney, Robert ^a   Hackett, Steve ^a   Zenner, Robert ^a   Li, Fuming ^a   Mader, Roger ^a   Hogerton, Peter ^a   Chaudhuri, Arun ^a   Stepniak, Frank ^a   Walsh, Matthew ^a  

^a 3M COMPANY   (United States)

Author keywords

Adhesive; Flip chip; Flux; No flow; Underfill; Wafer applied

Indexed keywords

ADHESIVES; DEGASSING; ELECTRONICS PACKAGING; SUBSTRATES; THERMOGRAVIMETRIC ANALYSIS;

UNDERFILL ADHESIVES;

FLIP CHIP DEVICES;

EID: 0035772271     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. th Electronic Components and Technology Conference (ECTC).
2. th Electronic Components and Technology Conference (ECTC).
3. rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghampton, NY, September 1998.
4. rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghampton, NY, September 1998.
5. Bodan Ma, Eric Zhang, Sun Hee Hong, Quinn Tong, and Ann Savoca, "Material Challenges for Wafer Level Packaging", IEEE Proceedings, International Symposium on Advanced Packaging Materials, Brasselton, GA March, 2000.