Stability of Plasma Posttreated TiN Films Prepared by Alternating Cyclic Pulses of Tetrakis-Dimethylamido-Titanium and Ammonia

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 1, 2004, Pages 303-304

  Park, Seoung Gon ^a   Kim, Do Heyoung ^a  

^a Chonnam National University   (South Korea)

Author keywords

ALD; Plasma; Posttreatment; Resistivity; Stability; TiN

Indexed keywords

CONTAMINATION; ELECTRIC CONDUCTIVITY; FABRICATION; INTEGRATED CIRCUITS; METALLIC FILMS; PHYSICAL VAPOR DEPOSITION; PLASMAS; STABILITY;

ATOMIC LAYER DEPOSITION (ALD); POSTTREATMENT;

TITANIUM NITRIDE;

EID: 1842709284     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.303     Document Type: Article

References (11)

1. International Technology Roadmap for Semiconductors.
2. H. Jeon, J. W. Lee, Y. D. Kim, D. S. Kim and K. S. Yi: J. Vac. Sci. Technol. A 18 (2000) 1595.
3. M. Juppo, P. Alen, M. Ritala, T. Sajavaara, J. Keinonen and M. Leskela: Electrochem. Solid-State Lett. 5 (2002) C4.
4. J. W. Uhm and H. Jeon: Jpn. J. Appl. Phys. 40 (2001) 4657.
5. M. Juppo, P. Alen, M. Ritala and M. Leskela: J. Electrochem. Soc. 147 (2000) 3377.
6. J. S. Min, Y. W. Son, W. G. Kang, S. S. Chun and S. W. Kang: Jpn. J. Appl. Phys. 37 (1998) 4999.
7. D. J. Kim, Y. B. Jung, M. B. Lee, Y. H. Lee and J. H. Lee: Thin Solid Films 372 (2000) 276.
8. J.-H. Yun, E.-S. Choi, C.-M. Chang and C.-S. Lee: Jpn. J. Appl. Phys. 41 (2002) L418.
9. R. Kroger, M. Eizenberg, C. Marcadal and L. Chen: J. Appl. Phys. 91 (2002) 5149.
10. D. H. Kim, J. J. Kim, J.-W. Park and J. J. Kim: J. Electrochem. Soc. 143 (1996) L188.
11. J.-S. Park, M.-J. Lee, C.-S. Lee and S.-W. Kang: Electrochem. Solid-State Lett. 4 (2002) C17.