Integrated flip-chip flex-circuit packaging for power electronics applications

IEEE Transactions on Power Electronics

Volumn 19, Issue 2, 2004, Pages 515-522

  Xiao, Ying ^a   Shah, Hemal N ^a   Natarajan, Ramanan ^a   Rymaszewski, Eugene J ^a   Chow, T Paul ^a   Gutmann, Ronald J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Flex circuit; Flip chip; Packaging parasitics; Power electronics packaging; Switching energy loss; Voltage overshoot

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FLIP FLOP CIRCUITS; INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS; SOLDERING;

FLEX CIRCUIT; PACKAGING PARASITICS; SWITCHING ENERGY LOSS; VOLTAGE OVERSHOOT;

POWER ELECTRONICS;

EID: 1842475493     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2003.820586     Document Type: Article

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