High frequency, low cost, power packaging using thin film power overlay technology

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 1995, Pages 12-17

  Fisher, R ^a   Fillion, R ^a   Burgess, J ^a   Hennessy, W ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; MULTICHIP MODULES; PERFORMANCE; POWER AMPLIFIERS; RELIABILITY; SEMICONDUCTOR DEVICE STRUCTURES; THIN FILMS;

CONVERSION EFFICIENCY; POWER PACKAGING; THIN FILM POWER OVERLAY TECHNOLOGY;

POWER SUPPLY CIRCUITS;

EID: 0029234758     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)