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Volumn 1, Issue , 2002, Pages 106-111

Novel power MOSFET packaging technology doubles power density in synchronous buck converters for next generation microprocessors

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTANCE; ELECTRIC LOSSES; ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER SYSTEMS; MICROPROCESSOR CHIPS; MOSFET DEVICES; POWER CONVERTERS; SURFACE MOUNT TECHNOLOGY;

EID: 0036072458     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (24)

References (0)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.