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Volumn 1, Issue , 2002, Pages 106-111
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Novel power MOSFET packaging technology doubles power density in synchronous buck converters for next generation microprocessors
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC CONDUCTANCE;
ELECTRIC LOSSES;
ELECTRIC NETWORK ANALYSIS;
ELECTRIC POWER SYSTEMS;
MICROPROCESSOR CHIPS;
MOSFET DEVICES;
POWER CONVERTERS;
SURFACE MOUNT TECHNOLOGY;
BUCK CONVERTERS;
CHIP SCALE PACKAGES;
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EID: 0036072458
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (24)
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References (0)
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