Flip-chip flex-circuit packaging for 42 V/16A integrated power electronics module applications

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 2002, Pages 21-26

  Xiao, Y ^a   Natarajan, R ^a   Chow, T P ^a   Rymaszewski, E J ^a   Gutmann, R J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INDUCTANCE; INTERCONNECTION NETWORKS;

FLIP-CHIP FLEX-CIRCUIT PACAKAGING;

POWER ELECTRONICS;

EID: 0036079549     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Power electronics technology-status and future
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3. Embedded power technology for IPEM package applications
4. SPCO's thinpak package - An ideal building block for power modules and power hybrids
5. Flip-chip die attach development for multi-chip mechatronics power packages
6. Flip-chip flex circuit packaging for power electronics
7. The utilization of polymer thick film and flex technology for low cost power electronics packaging of DC/DC down converters
8. Generating sparse partial inductance matrices with guaranteed stability
9. Integrated electrical and thermal analysis of integrated power electronics modules using iSIGHT
10. Three-dimensional flip-chip on flex packaging for power electronics applications