Thermal Cycling Induced Plastic Deformation in Solder Joints — Part II: Accumulated Deformation in Through Hole Joints

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 14, Issue 4, 1991, Pages 824-832

  Pan, Tsung Yu ^a  

^a FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIMONY AND ALLOYS--APPLICATIONS; ELECTRONICS PACKAGING--MATHEMATICAL MODELS; ELECTRONICS PACKAGING--SOLDERING; LEAD AND ALLOYS--APPLICATIONS; MATHEMATICAL TECHNIQUES--FINITE ELEMENT METHOD;

FATIGUE LIFE PREDICTIONS; NONLINEAR ELASTIC/PLASTIC PLUS CREEP BEHAVIOR; SOLDER JOINTS; THERMAL CYCLING INDUCED PLASTIC DEFORMATION; THROUGH HOLE JOINTS;

SOLDERING;

EID: 0026398794     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.105140     Document Type: Article

References (16)

1. T.-Y. Pan, “Thermal cycling induced plastic deformation in solder joints, Part I: Accumulated deformation in surface mount joints,” ASME Trans. J. Electron. Pack., vol. 113, no. 1, pp. 8–15, Mar. 1991; also T.-Y. Pan and W. L. Winterbottom, “Thermal cycling induced plastic deformation in solder joints,” presented at ASME Winter Ann. Meeting, Dallas, TX, Nov. 25–30, 1990.
2. J. W. Munford, “The influence of several design and material variables of the propensity for solder joint cracking,” IEEE Trans. Parts, Hybrids, Pack., vol. PHP-11, pp. 296–304, 1975.
3. E. Baker, “Calculation of thermally induced mechanical stresses in encapsulated assemblies,” IEEE Trans. Parts, Mat., Pack., vol. PMP-6, pp. 121–128, 1970.
4. J. Uebbing, “Mechanisms of temperature cycle failure in encapsulated optoelectronic devices,” in 19th Ann. Proc. of Reliability Physics, 1981, pp. 149–156.
5. J. L. Marshall and S. R. Walter, “Fatigue of solders,” Int. J. Hybrid Microelectron., vol. 10, no. 1, pp. 11–17, 1987.
6. J. L. Marshall, “Characterization of solder fatigue in electronic packaging,” in 12th Ann. Electronics Manufacturing Seminar Proc., Feb. 17–19, 1988, pp. 389–411.
7. R. Govila, Ford Technical Report, SR-88-78, Sept. 1988; SR-89-71, June 1989.
8. D. Burgreen, “Review of thermal ratchetting,” Fatigue at Elevated Temperatures, American Society for Testing and Materials, 1973, pp. 535–551.
9. A. V. A. Swaroop and A. J. McEvily, Jr., “Analytical and experimental study of thermal ratchetting,” Fatigue at Elevated Temperatures, American Society for Testing and Materials, 1973, pp. 563–572.
10. P. J. Adams, “Thermal fatigue of solder joints in micro-electronic devices,” M.S. thesis, MIT, Aug. 1986.
11. E. Baker, “Stress relaxation in tin-lead solders,” Mat. Sci. Eng., vol. 38, pp. 241–247, 1979.
12. B. P. Kashyap and G. S. Murty, “Experimental constitutive relations for the high temperature deformation of a Pb-Sn eutectic alloy,” Mat. Sci. Eng., vol. 50, pp. 205–213, 1981.
13. D. A. Jeannotte, L. S. Goldmann, and R. T. Howard, “Package reliability,” in Microelectronics Packaging Handbook, R. R. Tummala and E. J. Rymaszewski, eds. New York: Van Nostrand Reinhold, 1989.
14. W. Engelmaier, “Surface mount solder joint long-term reliability: Design, testing, prediction,” Soldering Surface Mount Technol., no. 1, pp. 14–22, Feb. 1989.
15. S. Knecht. “Integrated matrix creep: Application to lifetime prediction of eutectic tin-lead solder joints,” in Materials Research Society Symp. Proc., vol. 203, Nov. 1990.
16. H. D. Solomon, V. Brzozowski, and D. G. Thompson, “Predictions of solder joint fatigue life,” in Proc. 40th Electronic Components Technology Conf., pp. 351–359, 1990.