Dynamic model for solder and the problem of accelerated life testing

Journal of Electronic Materials

Volumn 28, Issue 9, 1999, Pages 1008-1016

  Russell, Stan ^a   Grigals, Anne ^a   Clemente, Ed ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; FRICTION; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; SHEAR DEFORMATION; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING;

ACCELERATED LIFE TESTING;

ELECTRONICS PACKAGING;

EID: 0033365890     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0177-9     Document Type: Article

References (8)

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2. H.D. Solomon, The Mechanics of Solder Joint Interconnects, ed. D.R. Frear et al. (New York: Van Nostrand Reinhold, 1994), p. 199.
3. R. Arrowood, A. Mukherjee, and W.B. Jones, Solder Mechanics - A State of the Art Assessment, ed. D.R. Freer, W.B. Jones, and K.R. Kinsman (Warrendale, PA: TMS, 1991), p. 107.
4. G. Nicolis and I. Prigogine, Exploring Complexity (New York: W.H. Freeman and Co., 1989), p. 171.
5. G. Nicolis and F. Baras, J. Stat. Phys. 48, 1071 (1987).
6. S. Russell, Creep and Stress Relaxation in Miniature Structures and Components, ed. Harish D. Merchant (Warrendale, PA: TMS, 1997), p. 75.
7. D.S. Stone and M.M. Rashad, The Mechanics of Solder Joint Interconnects, eds. D.R. Frear et al. (New York: Van Nostrand Reinhold, 1994), p. 87.
8. P.L. Hacke, A.F. Sprecher, and H. Conrad, Creep and Stress Relaxation in Miniature Structures and Components, ed. Harish D. Merchant (Warrendale, PA: TMS, 1997), p. 217.