Wafer bumping: Fine-pitch and lead-free solder

Semiconductor International

Volumn 28, Issue 4, 2005, Pages

  LaBennett, Richard ^a   Yeh, Shing ^b  

^a RTI INTERNATIONAL   (United States)

^b DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVX CORP (CO); CALIFORNIA MICRO DEVICES (CMD) (CO); IBM (CO); INFINEON (CO); INTEL (CO); LEAD-FREE SOLDERS; UNITIVE (CO); WAFER-LEVEL PACKAGING (WLP);

AUTOMOTIVE INDUSTRY; CHIP SCALE PACKAGES; COST BENEFIT ANALYSIS; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; ELECTRONICS ENGINEERING; INTERNATIONAL COOPERATION; LEAD; SEMICONDUCTOR DEVICE MODELS;

SOLDERING;

EID: 17144398815     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

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