Squeegee bump technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 46-53

  Lin, Jong Kai ^a   Fang, Treliant ^a   Bajaj, Rajiv ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PASTES; COMPUTER CONTROL SYSTEMS; COST EFFECTIVENESS; DEFECTS; ELECTRONICS PACKAGING; MASKS; MECHANICAL TESTING; PHOTORESISTS; SHEAR STRENGTH; SILICON WAFERS; SOLDERING; THERMAL CYCLING;

CHIP SCALE PACKAGE; FINER PITCH DEVICES; SOLDER PRINTING; SQUEEGEE BUMP TECHNOLOGY; STENCIL PRINTING TECHNOLOGY;

FLIP CHIP DEVICES;

EID: 0034479818     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991173     Document Type: Article

References (7)

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3. M. Bixenman T. Fang Wafer solder bumping: Cleaning tools and processes Adv. Packag. 48 52 June/July 1999
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5. T. Fang W. H. Lytle M. E. Grupen-Shemansky W. Beckenbaugh Method of forming an electrical interconnect 1997 U.S. Patent pending
6. P. A. Totta R. P. Sopher SLT device metallurgy and its monolithic extension IBM J. Res. Develop. 13 3 226 238 May 1969
7. M. Warrior Reliability improvements in solder bump processing for flip chip Proc. 40th Electron. Comp. Technol. Conf. 1 460 469 Proc. 40th Electron. Comp. Technol. Conf. 1990 157 3478 122229