Dissolution of Cu into Sn-Based Solders during Reflow Soldering

Metals and Materials International

Volumn 9, Issue 6, 2003, Pages 577-581

  Lee, Jong Hyun ^b   Shin, Dong Hyuk ^c   Kim, Yong Seog ^a  

^a Hong Ik University   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Channel; Cu6Sn5; Reflow soldering; Sn 37Pb; Supersaturation

Indexed keywords

BINARY ALLOYS; COPPER; DISSOLUTION; LEAD ALLOYS; SUPERSATURATION;

CHANNEL; CU CONTENT; CU6SN5; PURE SN; REFLOW--SOLDERING; SN-37PB; SN-BASED SOLDERS; SOLUBILITY LIMITS;

SOLDERING;

EID: 1842472853     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027258     Document Type: Article

References (11)

1. M. Schaefer, W. Laub, R. A. Fournelle, and J. Liang, Design & Reliability of Solders and Solder Interconnections (eds., R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw, and W. L. Winterbottom), p. 247, TMS, Warrendale, PA (1997).
2. W. J. Boettinger, C. A. Handwerker, and U. R. Kattner, The Mechanics of Solder Alloy Wetting and Spreading (eds., F. G. Yost, F. M. Hosking, and D. R. Frear), Van Nostrand Reinhold, New York (1993).
3. K.N. Tu and K. Jeng, Mater. Sci. Eng. R 34, 1 (2001).
4. S. Chada, W. Laub, R. A. Fournelle, and D. Shangguan, J. Electron. Mater. 28, 1194 (1999).
5. C. Chada, R. A. Foumelle, W. Laub, and D. Shangguan, J. Electron. Mater. 29, 1214 (2000).
6. B. J. Lee, N. M. Hwang, and H. M. Lee, Acta mater. 45, 1867 (1997).
7. J. H. Lee, D. J. Park, J. T. Moon, Y. H. Lee, D. H. Shin, and Y. S. Kim, J. Electron. Mater. 29, 1153 (2000).
8. N. Saunders and A. P. Miodownik, Binary Alloy Phase Diagrams (eds., T. B. Massalski, H. Okamoto, P. R. Subramanian, and L. Kacprzak), p. 1481, ASM Int., Materials Park, OH (1990).
9. J. N. Heo, J. H. Lee, D. J. Park, S. Y. Kim, D. H. Shin, and Y. S. Kim, J. Kor. Inst. Met. & Mater. 37, 852 (1999).
10. J. H. Lee, J. H. Park, Y. H. Lee, and Y. S. Kim, J. Mater. Res. 16, 1227 (2001).
11. J. H. Lee and Y. S. Kim, J. Electronic Mater. 31, 576 (2002).