Mask Cost and Cycle Time Reduction

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5130, Issue , 2003, Pages 4-15

  Hsieh, H C ^a   Hung, Johnson ^a   Chin, Angus ^a   Lee, S C ^a   Shin, J J ^a   Liu, R G ^a   Lin, Burn ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Defect control; Mask cost; Mask cycle time; Mask technology; Mask technology roadmap

Indexed keywords

CLEANING; ETCHING; HEATING; INTEGRATED CIRCUITS; LITHOGRAPHY; OPTIMIZATION; PHASE SHIFT; RESEARCH AND DEVELOPMENT MANAGEMENT; TRANSISTORS;

CRITICAL DIMENSIONS (CD); CYCLE TIME REDUCTION; DEFECT CONTROL; MASK COSTS; MASK CYCLE TIME; MASK ERROR FACTORS (MEF); MASK TECHNOLOGY; MASK TECHNOLOGY ROADMAPS;

MASKS;

EID: 1642514835     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.504288     Document Type: Conference Paper

References (6)

1. Ed Muzio, SEMATECH, Optical extensions workshop, Optical lithography cost of ownership, Dec. 1 1999, Leuven, Belgium.
2. Brian J. Grenon, Grenon Consulting, Inc. Walter J. Trybula, International SEMATECH, "Mask Cost Projections".
3. Kurt R. Kimmel "The new mask technology challenge" SPIE Photomask and Next-Generation Lithography Mask Technology VIII vol. 4409 p. 1-11
4. Lynn, Eric C., et al., 'Progressive self-learning photomask defect classification", Proc. SPIE Vol. 4754 (2002), pp.482-490
5. F. Chang, et al., "Aerial-image-based inspection of binary (OPC) and embedded attenuated PSM", Proc. SPIE Vol. 4889 (2002), pp.1010-1017
6. Hiroyoshi Tanabe and Hisatake Sano "PMJ01 panel discussion review, 'Issue on mask technology for 100-nm lithography'" SPIE PMJ 2002