Dry cleaning technique for particle removal based on gas-flow and down-flow plasma

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 1, 2004, Pages 268-274

  Momonoi, Yoshinori ^a   Yokogawa, Kenetsu ^a   Izawa, Masaru ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CONTAMINATION; DRY CLEANING; ETCHING; FRICTION; PARTICLES (PARTICULATE MATTER); PLASMA APPLICATIONS; PLASMA FLOW; POLYSILICON; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; VACUUM; VAN DER WAALS FORCES; VISCOSITY; VISCOUS FLOW; X RAY PHOTOELECTRON SPECTROSCOPY;

CHARGE-BUILDUP DAMAGE; PARTICLE REMOVAL; VACUUM CHAMBERS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 1642387433     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1643399     Document Type: Conference Paper

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