Brush scrubbing emerges as future wafer-cleaning technology

Solid State Technology

Volumn 40, Issue 7, 1997, Pages 209-214

  Hymes, Diane ^a,b,c   Malik, Igor ^a,d,e   Zhang, Jackie ^a,f,g   Emami, Ramin ^a,h  

^a OnTrak Systems   (United States)

^b BROWN UNIVERSITY   (United States)

^c OnTrak Systems Inc   (United States)

^d INSTITUTE OF CHEMICAL TECHNOLOGY   (Czech Republic)

^e UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

^f NORTHEASTERN UNIVERSITY   (China)

^g SAN JOSE STATE UNIVERSITY   (United States)

^h DMET College   (India)

Author keywords

[No Author keywords available]

Indexed keywords

POLYVINYL ALCOHOLS; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE CLEANING;

BRUSH SCRUBBING;

SILICON WAFERS;

EID: 0031173552     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (11)

1. C. Krusell, D. I. Golland, "Cleaning Technologies for High Volume Production of Silicon Wafers," Semiconductor Cleaning Technology, Meeting of the Electrochemical Society, Flodida, 1989.
2. W.C. Krusell, J.M. de Larios, J. Zhang, "Mechanical Brush Scrubbing for PostCMP Clean," Solid State Technology, p. 109, July 1995.
3. J.M. de Larios, W.C. Krusell, "The Challenges of Post-Metal Polish Clean," SEMCON Southwest, Austin, October 1995.
4. S.R. Roy, et al., "Postchemical-Mechanical Planarization Cleanup Process for Interlayer Dielectric Films," J. Electrochem. Soc., Vol. 142, No. 1, January 1995.
5. J.M. de Larios, M. Ravkin, D. Hetherington, J. Doyle, "Post-CMP Cleaning for Oxide and Tungsten Applications," Semiconductor International, May 1996.
6. A. number of Physical Chemistry and Electrochemistry textbooks, e.g., A.W. Adarnson, Physical Chemistry of Surfaces, Fifth Edition, Wiley, 1990.
7. D.E. Jan, S. Raghavan, "Electrokinetic Characteristics of Ntride Wafers in Aqueous Solutions and their Impact on Particulate Deposition," J. Electrochem. Soc. 141, 2465, 1994.
8. W.C. Krusell, L.J. Malik, F. Mohr, D.J. Hymes, "Double-Side Sorubbing Beyond Post-CMP Cleaning," Fouth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing. Fall 1995 Electrochemical Society Meeting, p. 409.
9. J. Zhang, I. Malik, M. Pavkin et al., "Double Sided Sorubbing: An Effective Method for Multiple Cleaning Application," SEMCON China 95, September 19, 1995.
10. D.J. Hymes, L.J. Malik, "Effective Surface Cleaning with Double-Sided Scrubbing," Micro., p. 55, October 1996.
11. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, 1994.