Recrystallization texture of a copper electrodeposit with the 〈111〉 and 〈110〉 duplex orientation

Materials Science Forum

Volumn 408-412, Issue I, 2002, Pages 895-900

  Kang, Soo Young ^a   Lee, Dong Nyung ^b  

^a POSCO   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Copper; Deposition Textures; Electrodeposits; Recrystallization Textures

Indexed keywords

CRYSTAL ORIENTATION; ELECTRODEPOSITION; ELECTROLYSIS; MORPHOLOGY; RECRYSTALLIZATION (METALLURGY); TENSILE STRENGTH; TEXTURES;

RECRYSTALLIZATION TEXTURES;

COPPER;

EID: 0036955944     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.408-412.895     Document Type: Conference Paper

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