Extraction of frequency dependent characteristic transmission line parameters up to 20 GHz for global wiring in 90nm SOI/Cu technology

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2004, Pages 131-133

  Winkel, Thomas Michael ^a   Ktata, M Faiez ^b   Ludwig, Thomas ^a   Grabinski, Hartmut ^b   Klink, Erich ^a  

^a IBM   (Germany)

^b LEIBNIZ UNIVERSITY HANNOVER   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; ELECTRIC IMPEDANCE; ELECTRIC LINES; FREQUENCIES; MICROPROCESSOR CHIPS; SCATTERING PARAMETERS; SILICON ON INSULATOR TECHNOLOGY;

CONTACT PADS; GLOBAL WIRING; METAL LAYERS; PROPAGATION CONSTANTS;

ELECTRIC WIRING;

EID: 15944377412     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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