Squeeze cast composites for thermal management of power electronic devices

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 49, Issue , 2004, Pages 4018-4030

  Pickard, Sion M ^a   Withers, J C ^a   Loutfy, Raouf ^a  

^a MER CORPORATION   (United States)

Author keywords

Metal matrix composites; Pressure infiltration; Thermal management

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); ISOTROPIC COMPOSITES; PRESSURE INFILTRATION; THERMAL MANAGEMENT;

ALUMINUM; COPPER; ELECTRONIC EQUIPMENT; INFILTRATION; MAGNESIUM PRINTING PLATES; POWER ELECTRONICS; SEMICONDUCTING GALLIUM ARSENIDE; THERMAL CONDUCTIVITY; THERMAL STRESS;

METALLIC MATRIX COMPOSITES;

EID: 23844440953     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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