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Volumn 28, Issue 1, 2005, Pages 58-64

Compact thermal models for internal convection

Author keywords

Compact thermal models (CTMs); Heat transfer coefficient; Thermodynamic constraints

Indexed keywords

BOUNDARY CONDITIONS; ENTHALPY; HEAT CONVECTION; HEAT TRANSFER COEFFICIENTS; LAPLACE TRANSFORMS; MATHEMATICAL MODELS; OPTIMIZATION;

EID: 15744394152     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.843207     Document Type: Article
Times cited : (16)

References (12)
  • 3
    • 0034276195 scopus 로고    scopus 로고
    • Thermal dynamics and the time constant domain
    • Sep
    • V. Szekely and M. Rencz, "Thermal dynamics and the time constant domain," IEEE Trans. Compon. Packag. Technol., vol. 23, no. 3, pp. 587-594, Sep. 2000.
    • (2000) IEEE Trans. Compon. Packag. Technol. , vol.23 , Issue.3 , pp. 587-594
    • Szekely, V.1    Rencz, M.2
  • 4
    • 0033359074 scopus 로고    scopus 로고
    • Static and dynamic thermal modeling of ICs
    • M. N. Sabry, "Static and dynamic thermal modeling of ICs," Microelectron. J., vol. 30, pp. 1085-1091, 1999.
    • (1999) Microelectron. J. , vol.30 , pp. 1085-1091
    • Sabry, M.N.1
  • 6
    • 0035691287 scopus 로고    scopus 로고
    • Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems
    • Dec
    • W. Batty, C. E. Christoffersen, A. J. Panks, S. David, C. M. Snowden, and M. B. Steer, "Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 4, pp. 566-590, Dec. 2001.
    • (2001) IEEE Trans. Compon. Packag. Technol. , vol.24 , Issue.4 , pp. 566-590
    • Batty, W.1    Christoffersen, C.E.2    Panks, A.J.3    David, S.4    Snowden, C.M.5    Steer, M.B.6
  • 12
    • 0035248216 scopus 로고    scopus 로고
    • Integrated transient thermal and mechanical analysis of molded PBGA packages during thermal shock
    • Feb
    • L. L. Mercado, T.-Y. Lee, and J. Cook, "Integrated transient thermal and mechanical analysis of molded PBGA packages during thermal shock," IEEE Trans. Compon., Packag., Manufact. Technol. B, vol. 24. no. 1, pp. 66-75, Feb. 2001.
    • (2001) IEEE Trans. Compon., Packag., Manufact. Technol. B , vol.24 , Issue.1 , pp. 66-75
    • Mercado, L.L.1    Lee, T.-Y.2    Cook, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.