100 μm Pitch flip chip on foil assemblies with adhesive interconnections

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 527-534

  De Vries, J ^a   Van Delft, J ^a   Slob, C ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; DIFFUSION; ELECTRONICS PACKAGING; LIQUID CRYSTAL DISPLAYS; MOBILE TELECOMMUNICATION SYSTEMS; MOISTURE; SOLDERING;

ADHESIVE INTERCONNECTIONS; ELECTRICAL INTERCONNECTION; FOIL ASSEMBLIES; REFLOW--SOLDERING;

FLIP CHIP DEVICES;

EID: 15744380194     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.06.006     Document Type: Article

References (15)

1. S.X. Wu, K.X. Hu, and C.P. Yeh Contact reliability modeling and material behavior of conductive adhesives under thermomechanical loads J. Liu Conductive adhesives for electronics packaging 1999 Electrochemical Publications [chapter 6]
2. Divigalpitiya R, Hogerton P. Contact resistance of anisotropic conductive adhesives. In: Proc IMAPS2003, 2003. p. 471-6
3. J. de Vries, and E. Janssen Humidity and reflow resistance of flip chip on foil assemblies with conductive adhesive joints IEEE. Trans. Compon. Pack. Technol. 26 2003 563 568
4. Preconditioning of plastic surface mount devices prior to reliability testing. JESD22-A113, March 1999; Moisture/reflow sensitivity classification for non-hermetic solid state surface mount devices. IPC/JEDEC standard J-STD-020-B, July 2002
5. Z. Lai, and J. Liu Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates IEEE Trans. Compon. Pack. Manufact. Technol. 19 1996 644 660
6. J. Liu Recent advances in conductive adhesives for direct chip attach applications Microsyst. Technol. 5 1998 72 80
7. Olliff D, Gaynes M, Kodnani R, Zubelewicz A. Characterizing the failure envelope of a conductive adhesive. In: Int Symp Adv Pack Mater, 1997. p. 124-6
8. J. Liu On the failure mechanism of anisotropically conductive adhesive joints on copper metallization Int. J. Adhesion Adhesives 16 1996 285 287
9. Mießner R, Aschenbrenner R, Reichl H. Reliability study of flip chip on FR4 interconnections with ACA. In: 45th Electr Comp and Techn Conf 1999. p. 595-601
10. P. Palm, J. Määttänen, A. Tuominen, and E. Ristolainen Reliability of 80 μm pitch flip chip attachment on flex Microelectron. Reliab. 41 2001 633 638
11. Jokinen E, Seppälä A, Pienimaa S, Ristolainen E. Reliability of ACF flip chip joint on flexible substrate. In: 37th IMAPS Nordic Conf, 2000. p. 192-6
12. Caers JFJM, Zhao XJ, Lekens G, Dreesen R, Croes K, Wong EH. Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives. In: Proc Int IEEE Conf on the Business of Electronic Product Reliability and Liability, 2003. p. 171-6
13. J. de Vries Failure mechanism of anisotropic conductive adhesive interconnections in flip chip ICs on flexible substrates IEEE Trans. Compon. Pack Technol. 27 2004 161 166
14. Caers JFJM, Zhao XJ, Wong EH, Ong CK, Wu ZX, Ranjan R. Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives. In: Proc 53th ECTC Conference 2003. p. 1176-80
15. de Vries J, van Delft J, Slob C. SMT-Compatibility of adhesive flip chip on foil interconnections with 40 μm pitch. IEEE Trans Comp Pack Techn, submitted for publication