Characterizing the failure envelope of a conductive adhesive

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 124-127

  Olliff, Derrick ^a   Gaynes, Michael ^a   Kodnani, Ramesh ^a   Zubelewicz, Aleksander ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATERIALS TESTING; MECHANICAL TESTING; PERFORMANCE;

CONDUCTIVE ADHESIVE; CONDUCTIVE ADHESIVE INTERCONNECTS;

CONDUCTIVE MATERIALS;

EID: 0030674222     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)