Precision alignment packaging for microsystems with multiple fluid connections

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 2, Issue , 2001, Pages 3295-3302

  Galambos, Paul ^b   Benavides, Gilbert L ^a   Okandan, Murat ^a   Jenkins, Mark W ^a   Hetherington, Dale ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b MS 1080   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; MODIFICATION; OXIDATION; POLYETHER ETHER KETONES; PRESSURIZATION; THERMOPLASTICS;

MICROFLUIDICS; MICROSYSTEMS;

FLUIDICS;

EID: 1542620787     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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