New Laser Ablation Method for Non-Destructive Backside Sample Preparation

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 553-558

  Beaudoin, F ^a   Perdu, P ^a   Saviot, F ^b   Lewis, D ^b   Salin, F ^b  

^a CNES   (France)

^b UNIVERSITÉ DE BORDEAUX   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHARGE COUPLED DEVICES; ELECTRIC CONTACTS; ELECTRONICS PACKAGING; ETCHING; HEAT AFFECTED ZONE; INTEGRATED CIRCUIT LAYOUT; MICROMACHINING; NONDESTRUCTIVE EXAMINATION; OPTICAL RESOLVING POWER; SURFACE ROUGHNESS; THERMAL EFFECTS; ULTRASHORT PULSES;

CERAMIC PACKAGES; DECAPSULATION; LASER SCANNING;

LASER ABLATION;

EID: 1542360564     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. P. Perdu R. Desplats and F. Beaudoin, "Comparative Study of Sample Backside Preparation Techniques for Backside Analysis", ISTFA, Seattle (2000).
2. C. Körner R. Mayerhofer M. Hartmann and H.W. Bergmann, "Physical and Material Aspects in Using Visible Laser Pulses of Nanosecond Duration for Ablation", App. Phys. A, 63, 123-131 (1996).
3. W. Riede and J.B. Franck, "Nd:YAG Laser Induced Damage on Ultrathin Silicon Samples", SPIE, 2714, 289-293 (1996).
4. F. Korte S. Nolte B.N. Chichkov T. Bauer G. Kamlage T. Wagner C. Fallnich and H. Welling, "Far-field and Near-field Material Processing with Femtosecond Laser Pulses", App. Phys. A, 69, S7-S11 (1999).
5. X. Liu D. Du and G. Mourou, "Laser Ablation and Micromachining with Ultrashort Laser Pulses", IEEE Journal of Quantum Electronics, 33, 1706-1716 (1997).
6. M.D. Shirk and P.A. Molian, "A Review of Ultrashort Pulsed Laser Ablation of Materials", Journal of Laser Applications, 10, 18-28 (1998).