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Volumn , Issue , 2000, Pages 161-171

Comparative Study of Sample Preparation Techniques for Backside Analysis

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; GRINDING WHEELS; LASER ABLATION; MILLING (MACHINING); OPTICAL MICROSCOPY; PLASTICS; POLISHING; PROCESS CONTROL; SURFACE ROUGHNESS;

EID: 1542270816     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (23)

References (13)
  • 4
    • 0028330601 scopus 로고
    • Novel Failure Analysis Techniques Using Photon Probing With a Scanning Optical Microscope
    • E. Cole, "Novel Failure Analysis Techniques Using Photon Probing With a Scanning Optical Microscope», IRPS, 388-398 1994.
    • (1994) IRPS , pp. 388-398
    • Cole, E.1
  • 6
    • 0031676233 scopus 로고    scopus 로고
    • Backside Localization of Open and Shorted IC Interconnections
    • E. Cole, "Backside Localization of Open and Shorted IC Interconnections", IRPS, 129-136 (1998)
    • (1998) IRPS , pp. 129-136
    • Cole, E.1
  • 9
    • 0027884783 scopus 로고
    • Charge collection in p-n junctions excited with pulsed infrared lasers
    • A.H.Johnston, "Charge collection in p-n junctions excited with pulsed infrared lasers", IEEE transaction on Nuclear Sciences, 40, 6, 1694-1702 (1993).
    • (1993) IEEE Transaction on Nuclear Sciences , vol.40 , Issue.6 , pp. 1694-1702
    • Johnston, A.H.1
  • 10
    • 1542314524 scopus 로고    scopus 로고
    • Mechanical and chemical decapsulation
    • Desk reference, Third Edition
    • T. W. Lee, "Mechanical and chemical decapsulation", Microelectronic Failure Analysis, Desk reference, Third Edition, 61-71 (1997).
    • (1997) Microelectronic Failure Analysis , pp. 61-71
    • Lee, T.W.1
  • 12
    • 1542284484 scopus 로고    scopus 로고
    • A Review of Wet Etch Formulas for Silicon Semiconductor Failure Analysis
    • nd ISTFA, 319-330(1997).
    • (1997) nd ISTFA , pp. 319-330
    • Lee, T.W.1
  • 13
    • 0033284103 scopus 로고    scopus 로고
    • Novel Backside Sample Preparation for Advanced CMOS Integrated Circuits Failure Analysis
    • th IPFA, 119-122 (1999)
    • (1999) th IPFA , pp. 119-122
    • Chew, Y.1    Siek, K.H.2    Yee, W.M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.